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One of the biggest challenges in the production of PCBs has been layer-to-layer registration, due to current pinning processes that make it difficult to meet today’s PCB requirements. The introduction of optical alignment has now made it possible for many PCB manufacturers to move up the technology curve while lowering their production costs. This article appeared in the June 2012 issue of PCB Magazine and was written by Anthony G. Faraci, the founder of DIS Technology Inc